Surface Mount (For High Density Board) FSMD2920  FSMD1812 FSMD1210 FSMD1206 FSMD0805
 
Surface Mount PPTC - FSMD2920 Series    

 

   

                                      RoHS Compliant / (Lead Free) Available

 
Application: All high-density boards
Product Features: 2920 Dimension, Surface mountable, Solid state,
Faster time to trip than standard SMD devices.
Operation Current: 300mA~3A
Maximum Voltage: 6V~60V
Temperature Range: -40°C to 85°C
Agency Recognition: UL (E211981),
C_UL (E211981),
*TÜV (R50090556)

 

 
 

 

 
 

Part
Number

Hold
Current

Trip
Current

Rated
Voltage

Maximum
Current

Typical
Power

Max Time to Trip

Resistance Tolerance

RMIN

R1MAX

IH, A

IT, A

VMAX,Vdc

IMAX, A

Pd, W

Current

Time, S

ohms

ohms

FSMD030-2920

0.30

0.60

60

10

1.5

1.5

3.0

1.00

4.80

FSMD050-2920

0.50

1.00

60

10

1.5

2.5

4.0

0.30

1.40

FSMD075-2920

0.75

1.50

33

40

1.5

8.0

0.3

0.18

1.00

FSMD100-2920

1.10

2.20

33

40

1.5

8.0

0.5

0.09

0.41

FSMD125-2920

1.25

2.50

33

40

1.5

8.0

2.0

0.05

0.25

FSMD150-2920

1.50

3.00

33

40

1.5

8.0

2.0

0.05

0.23

FSMD185-2920

1.85

3.70

33

40

1.5

8.0

2.5

0.04

0.15

FSMD200-2920

2.00

4.00

16

40

1.5

8.0

4.5

0.035

0.120

FSMD250-2920

2.50

5.00

16

40

1.5

8.0

16

0.025

0.085

FSMD260-2920

2.60

5.20

6

40

1.5

8.0

20.0

0.020

0.075

FSMD300-2920

3.00

5.20

6

40

1.5

8.0

25.0

0.015

0.048

 
  IH=Hold current-maximum current at which the device will not trip at 23°C still air.
IT=Trip current-minimum current at which the device will always trip at 23°C still air.
V MAX=Maximum voltage device can withstand without damage at its rated current.
I MAX= Maximum fault current device can withstand without damage at rated voltage (V max).
Pd=Typical power dissipated from device when in the tripped state in 23°C still air environment.
RMIN=Minimum device resistance at 23°C.
R1MAX=Maximum device resistance at 23°C, 1 hour after tripping .
Termination pad characteristics
Termination pad materials: Tin-plated copper
* Note: (1) FSMD300-2920: TÜV Pending

 

 
                            

Part
Number

A

B

C

D

Min

Max

Min

Max

Min

Max

Min

FSMD030-2920

6.73

7.98

4.80

5.44

0.60

1.15

0.35

FSMD050-2920

6.73

7.98

4.80

5.44

0.60

1.15

0.35

FSMD075-2920

6.73

7.98

4.80

5.44

0.60

1.15

0.35

FSMD100-2920

6.73

7.98

4.80

5.44

0.40

1.00

0.35

FSMD125-2920

6.73

7.98

4.80

5.44

0.40

0.90

0.35

FSMD150-2920

6.73

7.98

4.80

5.44

0.40

0.90

0.35

FSMD185-2920

6.73

7.98

4.80

5.44

0.30

0.90

0.35

FSMD200-2920

6.73

7.98

4.80

5.44

0.30

0.90

0.35

FSMD250-2920

6.73

7.98

4.80

5.44

0.30

0.90

0.35

FSMD260-2920

6.73

7.98

4.80

5.44

0.30

0.90

0.35

FSMD300-2920

6.73

7.98

4.80

5.44

0.30

0.90

0.35

 

 
 
        

                      A=FSMD125-2920~FSMD300-2920

                      B=FSMD030-2920~FSMD100-2920

 

 
 
A = FSMD030-2920
B = FSMD050-2920
C = FSMD075-2920
D = FSMD100-2920
E = FSMD125-2920
F = FSMD150-2920
G = FSMD185-2920
H = FSMD200-2920
I = FSMD250-2920
J = FSMD260-2920
K = FSMD300-2920

 
 
 

 
 

P/N

Pcs /Bag

Reel/Tape

FSMD030-2920

-----

2K

FSMD050-2920

-----

2K

FSMD075-2920

-----

2K

FSMD100-2920

-----

2K

FSMD125-2920

-----

2K

FSMD150-2920

-----

2K

 

P/N

Pcs /Bag

Reel/Tape

FSMD185-2920

-----

2K

FSMD200-2920

-----

2K

FSMD250-2920

-----

2K

FSMD260-2920

-----

2K

FSMD300-2920

-----

2K

 

 

 
Warning:
  1. Operation beyond the specified maximum ratings or improper use may result in damage and possible electrical arcing and/or flame.
  2. PPTC device are intended for occasional overcurrent protection. Application for repeated overcurrent condition and/or prolonged trip are not anticipated.
  3. Avoid contact of PPTC device with chemical solvent. Prolonged contact will damage the device performance.

 

 
Pad Layouts, Solder Reflow and Rework Recommendations
The dimension in the table below provide the recommended pad layout for each FSMD1812 device

Pad dimensions (millimeters)
Device A B C
Nominal Nominal Nominal
All 2920 Series 5.10 2.30 5.60

Solder reflow

Profile Feature

Pb-Free Assembly

Average Ramp-Up Rate (Tsmax to Tp)

3 /second max.

Preheat :

Temperature Min  (Tsmin)

Temperature Max (Tsmax)

Time (tsmin to tsmax)

 

150

200

60-180 seconds

Time maintained above:

Temperature(TL)

Time (tL)

 

217

60-150 seconds

Peak/Classification Temperature(Tp) :

260

Time within 5 of actual Peak :

Temperature (tp)

 

20-40 seconds

Ramp-Down Rate :

6 /second max.

Time 25 to Peak Temperature :

8 minutes max.

Note 1: All temperatures refer to of the package,

measured on the package body surface.


Solder reflow

     Due to “Lead Free” nature, Temperature and Dwelling time for the soldering zone is higher than those for Regular. This may cause damage to other components.

1.       Recommended max past thickness > 0.25mm.

2.       Devices can be cleaned using standard methods and aqueous solvent.

3.       Rework use standard industry practices.

4.       Storage Environment : < 30 / 60%RH 

Caution:

1.       If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements.

2.       Devices are not designed to be wave soldered to the bottom side of the board.