Surface Mount (For High Density Board) FSMD2920  FSMD1812 FSMD1210 FSMD1206 FSMD0805
 
Surface Mount PPTC - FSMD0805 Series

 

        RoHS Compliant / (Lead Free) Available

   
Application: All high-density boards
Product Features: Small surface mount, Solid state
Faster time to trip than standard SMD devices
Lower resistance than standard SMD devices
Operation Current: 0.1A~1.0A
Maximum Voltage: 6V~15V
Temperature Range: -40°C to 85°C
Agency Recognition: Pending

 

   
 
   

Part

Number

Hold

Current

Trip

Current

Rated

Voltage

Max

Current

Typical

Power

Max Time to Trip

Resistance Tolerance

Current

Time

RMIN

R1MAX

IH, A

IT, A

VMAX, Vdc

IMAX, A

Pd, W

Amp

Sec

Ω

Ω

FSMD010-0805

0.10

0.30

15

100

0.5

0.50

1.50

0.700

6.000

FSMD020-0805

0.20

0.50

9

100

0.5

8.00

0.02

0.400

3.500

FSMD035-0805

0.35

0.75

6

100

0.5

8.00

0.10

0.250

1.200

FSMD050-0805R

0.50

1.00

6

100

0.5

8.00

0.10

0.150

0.850

FSMD075-0805R

0.75

1.50

6

40

0.6

8.00

0.20

0.090

0.350

FSMD100-0805R

1.00

1.95

6

40

0.6

8.00

0.30

0.060

0.210

 

   

IH=Hold current-maximum current at which the device will not trip at 23still air.
IT=Trip current-minimum current at which the device will always trip at 23 still air.
V MAX=Maximum voltage device can withstand without damage at it rated current.(I MAX)
I MAX= Maximum fault current device can withstand without damage at rated voltage (V MAX).
Pd=Typical power dissipated-type amount of power dissipated by the device when in the tripped state in 23 still air environment.
RMIN=Minimum device resistance at 23 prior to tripping.
R1MAX=Maximum device resistance at 23 measured 1 hour after tripping or reflow soldering of 260 for 20 seconds.
Termination pad characteristics
Termination pad materials:
Pure Tin

 

 

   

Part

Number

Figure

A

B

C

D

E

Min

Max

Min

Max

Min

Max

Min

Max

Min

Max

FSMD010-0805

1

2.00

2.30

1.20

1.50

0.55

1.00

0.20

0.60

FSMD020-0805

1

2.00

2.30

1.20

1.50

0.55

1.00

0.20

0.60

FSMD035-0805

1

2.00

2.30

1.20

1.50

0.45

0.75

0.20

0.60

FSMD050-0805R

2

2.00

2.20

1.20

1.50

0.55

1.25

0.20

0.60

0.10

0.45

FSMD075-0805R

2

2.00

2.20

1.20

1.50

0.55

1.25

0.20

0.60

0.10

0.45

FSMD100-0805R

2

2.00

2.20

1.20

1.50

0.75

1.80

0.20

0.60

0.10

0.45

 

   
   

 

   
 

A =FSMD010-0805

B =FSMD020-0805

C =FSMD035-0805

D =FSMD050-0805R

E =FSMD075-0805R

F =FSMD100-0805R


 

   

 

 

   
   
P/N
Pcs /Bag
Reel/Tape
FSMD010-0805
-----
4K
FSMD020-0805
-----
4K
FSMD035-0805
-----
4K
FSMD050-0805R ----- 3K
FSMD075-0805R ----- 3K
FSMD100-0805R ----- 3K

 

   
Warning:
  1. Operation beyond the specified maximum ratings or improper use may result in damage and possible electrical arcing and/or flame.
  2. PPTC device are intended for occasional overcurrent protection. Application for repeated overcurrent condition and/or prolonged trip are not anticipated.
  3. Avoid contact of PPTC device with chemical solvent. Prolonged contact will damage the device performance.

 

   
Pad Layouts, Solder Reflow and Rework Recommendations
The dimension in the table below provide the recommended pad layout for each FSMD1812 device

Pad dimensions (millimeters)
Device A B C
Nominal Nominal Nominal
All 0805 Series 1.20 1.00 1.50

Solder reflow

Profile Feature

Pb-Free Assembly

Average Ramp-Up Rate (Tsmax to Tp)

3 /second max.

Preheat :

Temperature Min  (Tsmin)

Temperature Max (Tsmax)

Time (tsmin to tsmax)

 

150

200

60-180 seconds

Time maintained above:

Temperature(TL)

Time (tL)

 

217

60-150 seconds

Peak/Classification Temperature(Tp) :

260

Time within 5 of actual Peak :

Temperature (tp)

 

20-40 seconds

Ramp-Down Rate :

6 /second max.

Time 25 to Peak Temperature :

8 minutes max.

Note 1: All temperatures refer to of the package,

measured on the package body surface.


Solder reflow

     Due to “Lead Free” nature, Temperature and Dwelling time for the soldering zone is higher than those for Regular. This may cause damage to other components.

1.       Recommended max past thickness > 0.25mm.

2.       Devices can be cleaned using standard methods and aqueous solvent.

3.       Rework use standard industry practices.

4.       Storage Environment : < 30 / 60%RH 

Caution:

1.       If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements.

2.       Devices are not designed to be wave soldered to the bottom side of the board.